RF Front End Module Engineer job

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All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.

Job Description:

Description

Join this team focused on developing leading-edge solutions for the current and emerging wireless RF Market targeting the RF Front End portion of the Ultra Mobile Devices.  Develop innovative multi-mode single-band and multi-band multi-mode Front End Modules (FEMs) for standards such as LTE and LTE-Advanced, and 5G to shape next-generation product family. You will be part of a winning project team designing modules that are matched to 50 Ohms utilizing a mixture of lumped and distributed element matching. You will be responsible for the design and characterization of the active modules which include 

• Architect layout plans for highly integrated FEM with different technologies,
• Perform multi-layer laminate module layout, and lead module laminate tape outs,
• Perform multi-layer laminate module simulations to achieve best-in class performance,
• Lead design of passive matching networks for optimum module performance,
• Guide integration engineers and technicians on module optimization based on simulation results,
• Actively participate on hands-on optimization of FEM prototypes and characterization,
• Be part of Advanced front end module architectures and semiconductor process development

This process will require a balance of hands-on work in the lab and the use of simulation tools such as Keysight’s ADS, Momentum and Ansoft’sHFSS.

Qualifications

Minimum Requirements:

• Master of Science in Electrical Engineering with an emphasis on RF/Microwave Technology
• 5+ years of experience in FEM design and related fields
• Working knowledge of Semiconductor Technologies used in Power Amplifiers, Low Noise Amplifiers, High-Q filter technologies, High Power High Isolation Multi-Throw Switches, various Coexistence and Noise Power Filters and auxiliary circuits
• Proficient with CAD tools such as ADS, Momentum, HFSS, Cadence Suite
• Ability to work in a fast-paced, project-oriented, team environment
• Demonstrated ability to work independently, and create and meet schedules
• Strong Communication Skills

Desired Requirements:

• MS in Electrical Engineering with an emphasis on RF/Microwaves
• Hybrid Chip-On-Board Design and Prototyping Experience
• At least Five years of Analog RF, PA, or FEM Design Experience
• Experience with RF filter design in Single and Multi-Layer Substrates
• Experience with Wireless System Design for Cellular or Data Markets
• Knowledge to design RF solutions for 3G and 4G market space

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.